Method of manufacturing faceplate for in-the-ear hearing aid

ABSTRACT

Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.

TECHNICAL FIELD

The present invention relates to a faceplate for an In-The-Ear (ITE)hearing aid and a method of manufacturing a faceplate for an ITE(In-The-Ear) hearing aid, and more particularly to, a faceplate for anIn-The-Ear (ITE) hearing aid and a method of manufacturing a faceplatefor an In-The-Ear (ITE) hearing aid in which the faceplate can bemanufactured in a compact size, using a foldable flexible printedcircuit board (PCB), while maintaining the quality, enablingmass-production, and reducing the manufacturing cost.

BACKGROUND ART

Among the currently available hearing aids or the hearing aids underdevelopment, ITE (In-The-Ear) type hearing aids which are respectivelyinserted into an external auditory canal are manufactured by individualsoldering various components such as a volume controller including amicrophone, an amplifier and a receiver with elongate electric wires.

However, in the case of analog hearing aids, amplifier terminals arecomparatively simple and thus it is not difficult to manufacture hearingaids through individual soldering.

However, in the case of digital hearing aids which are recentlyavailable in the market, amplifier terminals becomes large in numbersand complicated. That is, in the case of the digital hearing aids,approximately twenty elongate electric wires are soldered in eachdigital hearing aid. Accordingly, it is not only difficult to make itcompact but also highly experienced soldering experts are needed. As aresult, there are the problems that the hearing aids cannot bemass-produced while maintaining a certain level of high quality, andthus the manufacturing cost cannot be reduced.

DISCLOSURE OF THE INVENTION

To solve the above problems, it is an object of the present invention toprovide a faceplate for an In-The-Ear (ITE) hearing aid and a method ofmanufacturing a faceplate for an In-The-Ear (ITE) hearing aid in whichthe faceplate can be manufactured in a compact size, using a foldableflexible printed circuit board (PCB), while maintaining the quality andenabling mass-production.

It is another object of the present invention to provide a faceplate foran In-The-Ear (ITE) hearing aid and a method of manufacturing afaceplate for an In-The-Ear (ITE) hearing aid in which the manufacturingcost can be reduced.

To accomplish the above object of the present invention, there isprovided a method of manufacturing a faceplate for an ITE (In-The-Ear)hearing aid, the ITE hearing aid faceplate manufacturing methodcomprising:

a hot wind soldering process of soldering an acoustic processor (100)which receives and processes an acoustic signal in a first welding pad(142 a) of a first main flexible printed circuit board (PCB) (142);

a first manual soldering process of manually soldering an externalmemory button (22) and a receiver (138) in first and second weldingpatterns (142 b, 142 c) of the first main flexible PCB (142);

a second manual soldering process of manually soldering a frontmicrophone (12), a rear microphone (14) and a volume controller (20) inthird to fifth welding patterns (144 a, 144 b, 144 c) of a second mainflexible PCB (144);

a first flexible insulating plate covering process of folding andcovering a first flexible insulating plate (146) in order to insulate aconductive pattern exposed to the rear side of the first main flexiblePCB (142);

a battery positive electrode position fixing process of folding abattery positive electrode (148) for a battery (26) to abut the rearside of the first flexible insulating plate (146);

a second flexible insulating plate covering process of folding andcovering a second flexible insulating plate (150) in order to insulate aconductive pattern exposed to the rear side of the second main flexiblePCB (144);

a battery negative electrode position fixing process of folding abattery negative electrode (152) for the battery (26) in the rear sideof the second flexible insulating plate (150);

a first and second main flexible PCB aligning process of folding bothends of a side flexible PCB (154) at right angles and aligning the firstmain flexible PCB (142) and the second main flexible PCB (144) inparallel with each other;

a third manual soldering process of manually soldering a socket (18) ina sixth welding pattern (157) of a lower flexible PCB (156) which ispositioned in the lower end of the free end portion of the first mainflexible PCB (142);

a lower flexible PCB bending process of bending the lower flexible PCB(156) positioned in the lower end of the free end portion of the firstmain flexible PCB (142) inwards at right angles;

a first to third fixing bracket position fixing process of inserting thefirst and second main flexible PCBs (142, 144) which face each other andare bent in parallel with each other around the side flexible PCB (154)into the internal space of a molding body (11 a) for a faceplate andbending first to third fixing brackets (158, 159, 160) toward the outerside to then be position-fixed; and

a first and second bonding pad adhering process of adhering a secondbonding pad (164) of the second main flexible PCB (144) on a firstbonding pad (162) of the first main flexible PCB (142) to then be formedinto a box shape.

According to another aspect of the present invention, there is alsoprovided a faceplate for an ITE (In-The-Ear) hearing aid, the ITEhearing aid faceplate comprising:

a first main flexible PCB (Printed Circuit Board) (142) in whichcomponents of the hearing aid including a receiver (138) are soldered;

a second main flexible PCB (144) in which components of the hearing aidincluding microphones (12, 14) are soldered;

a first flexible insulating plate (146) which insulates a conductivepattern exposed to the rear side of the first main flexible PCB (142);

a battery positive electrode (148) for a battery (26) to abut the rearside of the first flexible insulating plate (146);

a second flexible insulating plate (150) which insulates a conductivepattern exposed to the rear side of the second main flexible PCB (144);

a battery negative electrode (152) for the battery (26) in the rear sideof the second flexible insulating plate (150);

a socket (18) which is manually soldered in a lower flexible PCB (156)which is positioned in the lower end of the free end portion of thefirst main flexible PCB (142);

first to third fixing brackets (158, 159, 160) which insert the firstand second main flexible PCBs (142, 144) which face each other and arebent in parallel with each other around the side flexible PCB (154) intothe internal space of a molding body (11 a) for a faceplate, to then beposition-fixed; and

first and second bonding pads in which the second bonding pad (164) ofthe second main flexible PCB (144) is adhered on the first bonding pad(162) of the first main flexible PCB (142) to then be formed into a boxshape.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and/or advantages of the present inventionwill become more apparent by describing the preferred embodiment thereofin detail with reference to the accompanying drawings in which:

FIG. 1 is a perspective view of an ITE (In-The-Ear) hearing aidaccording to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the ITE hearing aid according to theembodiment of the present invention;

FIG. 3 is a front view of the ITE hearing aid according to theembodiment of the present invention;

FIG. 4 is a cross-sectional view of a faceplate of the ITE hearing aidcut along a line A-A of FIG. 2, according to the embodiment of thepresent invention;

FIG. 5 is a partially unfolded perspective view of a flexible printedcircuit board (PCB) for the ITE hearing aid according to the embodimentof the present invention;

FIG. 6 is a flowchart view which illustrates a method of assembling theflexible PCB of FIG. 5;

FIG. 7 is a circuit block diagram of an acoustic processor which isapplied to the embodiment of the present invention;

FIG. 8 is a connection diagram schematically showing the state thatfront and rear microphones, a telecoil, a memory button, a volumecontroller, a socket, a receiver are soldered at the terminals of thecircuit blocks in the acoustic processor; and

FIG. 9 is a plan view of the flexible PCB applied to the embodiment ofthe present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinbelow, a method of manufacturing a faceplate for an ITE(In-The-Ear) hearing aid and a faceplate using the same according to thepresent invention will be described with reference to the accompanyingdrawings.

FIG. 1 is a perspective view of an ITE (In-The-Ear) hearing aidaccording to an embodiment of the present invention. FIG. 2 is across-sectional view of the ITE hearing aid according to the embodimentof the present invention. FIG. 3 is a front view of the ITE hearing aidaccording to the embodiment of the present invention. FIG. 4 is across-sectional view of a faceplate of the ITE hearing aid cut along aline A-A of FIG. 2, according to the embodiment of the presentinvention. FIG. 7 is a circuit block diagram of an acoustic processorwhich is applied to the embodiment of the present invention. FIG. 8 is aconnection diagram schematically showing the state that front and rearmicrophones, a telecoil, a memory button, a volume controller, a socket,a receiver are soldered at the terminals of the circuit blocks in theacoustic processor. FIG. 9 is a plan view of the flexible PCB applied tothe embodiment of the present invention.

As shown in FIGS. 1-4 and 7-9, an ITE (In-The-Ear) hearing aid accordingto an embodiment of the present invention includes: a shell 10 formed ina snail shape; a faceplate 11 which is installed at the input side ofthe shell 10; front and rear microphones 12 and 14 which are installedon the faceplate 11 to receive an acoustic signal; a telecoil 16filtering high-band noise at the time of a telephone call; a socket 18which receives parameters including for example, a news listeningparameter (hereinafter referred to as an M1 mode parameter), a musiclistening parameter (hereinafter referred to as an M2 mode parameter), anormal dialogue listening parameter at the place where noise is small(hereinafter referred to as an M3 mode parameter), and an abnormaldialogue listening parameter at the place where noise is loud(hereinafter referred to as an M4 mode parameter) from an externalcontrol personal computer (not shown), to then control an auditory sensedifference; a volume controller 20 controlling the reception volume ofthe acoustic signal received by the telecoil 16 and the front and rearmicrophones 12 and 14; an external memory button 22 selecting one of theM1 to M4 mode parameters which are input from the personal computer; anacoustic processor 100 which is installed in the faceplate 11 andprocesses the acoustic signal which is received by the telecoil 16 andthe front and rear microphones 12 and 14; a receiver 138 which receivesand outputs the acoustic signal processed in the acoustic processor 100;a battery 26 supplying an operating voltage to the acoustic processor100; an accommodation space 28 accommodating the battery 26; a cover 30opening and closing the opening of the accommodation space 28; and atube 32 which connects the faceplate 11 and the shell 10, andsimultaneously in which the receiver 138 is disposed in the middle ofthe tube 32 in order to output the acoustic signal to an eardrum.

As shown in FIG. 7, the acoustic processor 100 includes a voltageregulator 121 which receives a direct-current (DC) voltage supplied fromthe battery 26 via an input terminal 112 and regulates the input DCvoltage into a constant DC voltage to then output the same; a firstcapacitor C1 which filters the noise of a high level included in theconstant DC voltage regulated in the voltage regulator 121, and suppliesthe filtered result to the front and rear microphones 12 and 14 throughan output terminal 107, respectively; second and third capacitors C2 andC3 which receive the acoustic signal received by the front and rearmicrophones 12 and 14 via input terminals 109 and 106, and filter thenoise of a high level included in the acoustic signal, respectively; afourth capacitor C4 which receives the acoustic signal received by thetelecoil 16 via an input terminal 110 and filters the noise of a highlevel included in the acoustic signal, in the case that a movingterminal 124 a of a changeover switch 124 is connected to the fourthcapacitor C4, that is, at the time of a telephone call which isconnected to a fixed terminal 124 c; first and second analog-to-digital(A/D) converters 123 and 125 which receive an analog acoustic signalfrom which the noise of a high level included in the acoustic signalreceived by the telecoil 16 has been filtered, and converts the analogacoustic signal into a digital acoustic signal, respectively, in thecase that the moving terminal 124 a of the changeover switch 124 isconnected to the third capacitor C3, that is, at the time of a telephonecall which is connected to a fixed terminal 124 a, or the noise of ahigh level included in the acoustic signal received by the front andrear microphones 12 and 14 is filtered in the fourth capacitor C4, or inthe case that the moving terminal 124 a of the changeover switch 124 isconnected to the fourth capacitor C4, that is, at the time of atelephone call which is connected to a fixed terminal 124 c; adelay/mixture circuit 127 which receives the digital signals from theA/D converters 123 and 125 and delays and mixes the received digitalsignals; a fifth capacitor C5 which receives an acoustic signal whosevolume is controlled by a volume controller 20 via an input terminal 105and filters the noise included in the acoustic signal; a volume signalA/D converter 129 which receives an analog acoustic signal from whichthe noise included in the acoustic signal whose volume is controlled bythe fifth capacitor C5 has been filtered and converts the analogacoustic signal into a digital signal; an EEPROM (Electrically ErasableProgrammable Read Only Memory) 133 which receives a news listeningparameter, a music listening parameter, a normal situation dialoguelistening parameter, and a loud situation dialogue listening parametervia the socket 18 and the input terminal 104 from an external controlpersonal computer (not shown) and storing a mode signal interfaced in aninterface circuit 131; an equalizer 135 which receives the digitalvolume signal which has been converted into the digital signal in thevolume signal A/D converter 129 which has received the digital acousticsignal which has been delayed and mixed in the delay/mixture circuit127, and one parameter of the news listening parameter, the musiclistening parameter, the normal situation dialogue listening parameter,and the loud situation dialogue listening parameter at the place wherethe noise is loud from the EEPROM 133, and divides the frequency band ofthe acoustic signal of the received result into first to fourth channelbands, to then amplify and mix the divided acoustic signal; adigital-to-analog (D/A) converter 137 which receives the mixed digitalacoustic signal which is output from a mixer 135 e of the equalizer 135and converts the received digital acoustic signal into an analog signal;and a receiver 138 which receives the analog acoustic signal output fromthe D/A converter 137 via output terminals 115 and 101 to then outputthe analog acoustic signal to an auditory organ.

The equalizer 135 includes first through fourth channel amplifiers 135a, 135 b, 135 c, and 135 d which divide the frequency band of theacoustic signal into first through fourth channels and amplify thedivided acoustic signal, respectively, and a mixer 135 e which mixes theacoustic signals which are obtained after the first through fourthamplifiers 135 a, 135 b, 135 c, and 135 d have divided and amplifiedaccording to the respective frequency bands.

In the drawings, a reference numeral 102 denotes a grounded terminal,and a reference numeral 114 denotes a voltage battery power terminal.

Next, a method of manufacturing a faceplate 11 for an ITE hearing aidaccording to an embodiment of the present invention will be describedwith reference to FIGS. 5 and 6.

FIG. 5 is a partially unfolded perspective view of a flexible printedcircuit board (PCB) for the ITE hearing aid according to the embodimentof the present invention, and FIG. 6 is a flowchart view whichillustrates a method of assembling the flexible PCB of FIG. 5.

Referring to FIGS. 5 and 6, a method of manufacturing a faceplate for anITE (In-The-Ear) hearing aid, includes a hot wind soldering processS600, a first manual soldering process S610, a second manual solderingprocess S615, a first flexible insulating plate covering process S620, abattery positive electrode position fixing process S625, a secondflexible insulating plate covering process S630, a battery negativeelectrode position fixing process S635, a first and second main flexiblePCB aligning process S640, a third manual soldering process S645, alower flexible PCB bending process S650, a first to third fixing bracketposition fixing process S655, and a first and second bonding padadhering process S660.

The hot wind soldering process S600 solders an acoustic processor 100which receives and processes an acoustic signal in a first welding pad142 a of a first main flexible printed circuit board (PCB) 142.

The first manual soldering process S610 manually solders an externalmemory button 22 and a receiver 138 in first and second welding patterns142 b and 142 c of the first main flexible PCB 142 where the acousticprocessor 100 has been soldered in the hot wind soldering process S600.

The second manual soldering process S615 manually solders a frontmicrophone 12, a rear microphone 14 and a volume controller 20 in thirdto fifth welding patterns 144 a, 144 b, and 144 c of a second mainflexible PCB 144 after the first manual soldering process S610.

The first flexible insulating plate covering process S620 folds andcovers a first flexible insulating plate 146 in order to insulate aconductive pattern exposed to the rear side of the first main flexiblePCB 142.

The battery positive electrode position fixing process S625 folds abattery positive electrode 148 for a battery 26 to abut the rear side ofthe first flexible insulating plate 146 after the first flexibleinsulating plate covering process S620.

The second flexible insulating plate covering process S630 folds andcovers a second flexible insulating plate 150 in order to insulate aconductive pattern exposed to the rear side of the second main flexiblePCB 144 after the battery positive electrode position fixing processS625.

The battery negative electrode position fixing process S635 folds abattery negative electrode 152 for the battery 26 in the rear side ofthe second flexible insulating plate 150 after the second flexibleinsulating plate covering process S630.

The first and second main flexible PCB aligning process S640 folds bothends of a side flexible PCB 154 at right angles and aligning the firstmain flexible PCB 142 and the second main flexible PCB 144 in parallelwith each other, after the battery negative electrode position fixingprocess S635.

The third manual soldering process S645 manually solders a socket 18 ina sixth welding pattern 157 of a lower flexible PCB 156 which ispositioned in the lower end of the free end portion of the first mainflexible PCB 142 after the first and second main flexible PCB aligningprocess S640.

The lower flexible PCB bending process S650 bends the lower flexible PCB156 positioned in the lower end of the free end portion of the firstmain flexible PCB 142 inwards at right angles.

The first to third fixing bracket position fixing process S655 insertsthe first and second main flexible PCBs 142 and 144 which face eachother and are bent in parallel with each other around the side flexiblePCB 154 into the internal space of a molding body 11 a for a faceplateand bending first to third fixing brackets 158, 159, and 160 toward theouter side to then be position-fixed.

The first and second bonding pad adhering process S660 adheres a secondbonding pad 164 of the second main flexible PCB 144 on a first bondingpad 162 of the first main flexible PCB 142 to then be formed into a boxshape, after the first to third fixing bracket position fixing processS655.

Next, a function and an effect of the ITE hearing aid according to theembodiment of the present invention will be described below.

Firstly, after an ITE hearing aid according to the present invention hasbeen manufactured, the socket 18 installed at the accommodation space 28in accommodating the battery 26 is connected with a personal computer(not shown) via a cable or a universal serial bus (USB) cable. Then,parameters stored in the external control personal computer (not shown)including for example, a news listening parameter (M1 mode parameter), amusic listening parameter (M2 mode parameter), a normal dialoguelistening parameter at the place where noise is small (M3 modeparameter), and an abnormal dialogue listening parameter at the placewhere noise is loud (M4 mode parameter) from an external controlpersonal computer (not shown), are input to the ITE hearing aid to thencontrol an auditory sense difference. The parameters are stored in theEEPROM 131 through the socket 18 and the interface circuit. If theexternal memory button 22 is depressed, an acoustic signal is selectedaccording to various kinds of environmental circumstances to then belistened.

In other words, if the external memory button 22 is pressed once, thenews listening parameter (M1 mode parameter) which enables a user tolisten to the news stored in the EEPROM 131 is input to the equalizer135, to accordingly enable the user to listen to the news at ahigh-sensitivity.

If the external memory button 22 is pressed twice, the music listeningparameter (M2 mode parameter) which enables a user to listen to themusic stored in the EEPROM 131 is input to the equalizer 135, toaccordingly enable the user to listen to the music at ahigh-sensitivity.

If the external memory button 22 is pressed three times, the normalsituation dialogue listening parameter (M3 mode parameter) stored in theEEPROM 131 at the place where the noise is small is input to theequalizer 135, to accordingly enable the user to listen to the dialogueat a high-sensitivity.

If the external memory button 22 is pressed four times, the abnormalsituation dialogue listening parameter (M4 mode parameter) which enablesthe user to listen to the dialogue stored in the EEPROM 131 at the placewhere the noise is loud is input to the equalizer 135, to accordinglyenable the user to listen to the dialogue at the place which the noiseis loud at a high-sensitivity.

As described above, the ITE hearing aid according to the presentinvention is initialized. Then, if the ITE hearing aid is inserted intothe external auditory canal of an ear, and if the external memory button22 is pressed once in order to listen to the news at the state that themoving contact 124 a of the changeover switch 124 is set to the fixedcontact 124 b, the news listening parameter (M1 mode parameter) whichenables the user to listen to the news stored in the EEPROM 131 is inputto the equalizer 135. Accordingly, the front and rear microphones 12 and14 receive news acoustic signals which are output from a televisionreceiver or radio and are input to input terminals 109 and 116 of theacoustic processor 100. The acoustic processor 100 filters the noise ofa high level included in the news acoustic signals which are received inthe front and rear microphones 12 and 14, respectively, and converts theanalog news acoustic signals into the digital news acoustic signals inthe first and second A/D converters 123 and 125 to then be output to thedelay/mixture circuit 127.

The delay/mixture circuit 127 receives the news acoustic signals whichhave been transformed into the digital news acoustic signals in thefirst and second A/D converters 123 and 125 and delays andsimultaneously mixes the digital acoustic signals to then output theresult to the equalizer 135. The equalizer 135 receives the newsacoustic signal which is obtained by matching a phase difference betweenthe news acoustic signal received in the front microphone 12 delayed bythe delay/mixture circuit 127 and the news acoustic signal received inthe rear microphone 14 and mixing the news acoustic signals which havebeen received by the front and rear microphones 12 and 14, and dividesthe frequency band of the received news acoustic signals into the firstto fourth channel bands 135 a, 135 b, 135 c, and 135 d and amplifies thedivided channel bands, respectively. The news acoustic signals which areobtained by dividing the acoustic signals into the first to fourthchannel bands 135 a, 135 b, 135 c, and 135 d and amplifying the dividedchannel bands are mixed in the mixer 135 e of the equalizer 135 to thenbe output to the D/A converter 137.

The D/A converter 137 receives the digital news acoustic signal which isobtained by dividing the news acoustic signals into the first to fourthchannel bands 135 a, 135 b, 135 c, and 135 d and amplifying the dividedchannel bands to thus mix the amplified news acoustic signals in theequalizer 135, and converts the received digital acoustic signal intothe analog signal and outputs the analog signal through output terminals115 and 101 to the receiver 138. The receiver 138 outputs the analognews acoustic signal so as to be audible to the auditory sensing organ.

Here, if the news acoustic signal which is to listen is so high or solow, the volume controller 20 is controlled to set the sound level to agood level to listen. Then, the sound level which has been set to a goodlevel to listen is input through the input terminal 105 to the volumesignal A/D converter 129. Then, the volume signal A/D converter 129receives the analog news acoustic signal and converts the receivedanalog news acoustic signal into the digital signal to then output thedigital signal to the output terminal of the mixer 135 e of theequalizer 135 and set the volume of the news acoustic signal.

Meanwhile, if the ITE hearing aid is inserted into the external auditorycanal of an ear, at the state where the ITE hearing aid according to thepresent invention is initialized, and if the moving contact 124 a of thechangeover switch 124 is set to the fixed contact point 124 c, itbecomes possible to make a telephone call.

As described above, if the ITE hearing aid is inserted into the externalauditory canal of an ear, at the state where the ITE hearing aidaccording to the present invention is initialized, and if the externalmemory button 22 is pressed twice at the state that the moving contact124 a of the changeover switch 124 is set to the fixed contact 124 c,the music listening parameter (M2 mode parameter) which enables the userto listen to the music stored in the EEPROM 131 is input to theequalizer 135, to accordingly enable the user to listen to the music ata high-sensitivity. If the external memory button 22 is pressed threetimes, the normal situation dialogue listening parameter (M3 modeparameter) stored in the EEPROM 131 at the place where the noise issmall is input to the equalizer 135, to accordingly enable the user tolisten to the dialogue at a high-sensitivity. If the external memorybutton 22 is pressed four times, the abnormal situation dialoguelistening parameter (M4 mode parameter) which enables the user to listento the dialogue stored in the EEPROM 131 at the place where the noise isloud is input to the equalizer 135, to accordingly enable the user tolisten to the dialogue at the place which the noise is loud at ahigh-sensitivity.

Since the remaining operations of the ITE hearing aid according to thepresent invention are similar to the operation for listening to the newsas described above, at this state, the detailed description thereof willbe omitted.

INDUSTRIAL APPLICABILITY

As described above, the present invention provides a faceplate for anIn-The-Ear (ITE) hearing aid and a method of manufacturing a faceplatefor an In-The-Ear (ITE) hearing aid in which the faceplate can bemanufactured in a compact size, using a foldable flexible printedcircuit board (PCB), while maintaining the quality, enablingmass-production, and reducing the manufacturing cost.

As described above, the present invention has been described withrespect to a particularly preferred embodiment. However, the presentinvention is not limited to the above embodiment, and it is possible forone who has an ordinary skill in the art to make various modificationsand variations, without departing off the spirit of the presentinvention. Thus, the protective scope of the present invention is notdefined within the detailed description thereof but is defined by theclaims to be described later and the technical spirit of the presentinvention.

1. A method of manufacturing a faceplate for an ITE (In-The-Ear) hearingaid, the ITE hearing aid faceplate manufacturing method comprising: ahot wind soldering process of soldering an acoustic processor (100)which receives and processes an acoustic signal in a first welding pad(142 a) of a first main flexible printed circuit board (PCB) (142); afirst manual soldering process of manually soldering an external memorybutton (22) and a receiver (138) in first and second welding patterns(142 b, 142 c) of the first main flexible PCB (142) where the acousticprocessor (100) has been soldered in the hot wind soldering process; asecond manual soldering process of manually soldering a front microphone(12), a rear microphone (14) and a volume controller (20) in third tofifth welding patterns (144 a, 144 b, 144 c) of a second main flexiblePCB (144) after the first manual soldering process; a first flexibleinsulating plate covering process of folding and covering a firstflexible insulating plate (146) in order to insulate a conductivepattern exposed to the rear side of the first main flexible PCB (142); abattery positive electrode position fixing process of folding a batterypositive electrode (148) for a battery (26) to abut the rear side of thefirst flexible insulating plate (146) after the first flexibleinsulating plate covering process; a second flexible insulating platecovering process of folding and covering a second flexible insulatingplate (150) in order to insulate a conductive pattern exposed to therear side of the second main flexible PCB (144) after the batterypositive electrode position fixing process; a battery negative electrodeposition fixing process of folding a battery negative electrode (152)for the battery (26) in the rear side of the second flexible insulatingplate (150) after the second flexible insulating plate covering process;a first and second main flexible PCB aligning process of folding bothends of a side flexible PCB (154) at right angles and aligning the firstmain flexible PCB (142) and the second main flexible PCB (144) inparallel with each other, after the battery negative electrode positionfixing process; a third manual soldering process of manually soldering asocket (18) in a sixth welding pattern (157) of a lower flexible PCB(156) which is positioned in the lower end of the free end portion ofthe first main flexible PCB (142) after the first and second mainflexible PCB aligning process; a lower flexible PCB bending process ofbending the lower flexible PCB (156) positioned in the lower end of thefree end portion of the first main flexible PCB (142) inwards at rightangles; a first to third fixing bracket position fixing process ofinserting the first and second main flexible PCBs (142, 144) which faceeach other and are bent in parallel with each other around the sideflexible PCB (154) into the internal space of a molding body (11 a) fora faceplate and bending first to third fixing brackets (158, 159, 160)toward the outer side to then be position-fixed; and a first and secondbonding pad adhering process of adhering a second bonding pad (164) ofthe second main flexible PCB (144) on a first bonding pad (162) of thefirst main flexible PCB (142) to then be formed into a box shape, afterthe first to third fixing bracket position fixing process.